In this article from EU Research (EU Research AUT21/P52), learn how Egide, with the other members of the "Heatpack" European consortium, tackles the problem of power dissipation with new packaging solutions.
At the 24th European Microelectronics & Packaging Conference (EMPC 2023), Egide presented its abilities to design and produce complex multi layers HTCC solutions for high frequency hermetic packages. These innovative solutions address the critical challenges faced by the electronics industry in developing high-performance devices for applications such as 5G, radar, and optical communications.
Coherent optical networks can provide larger transmission capacity and much distance up to 100 times mor than non-coherent networks (thousands Km for coherent versus tens Km for non-coherent). Coherent modulators are vital components for such high-speed coherent communication networks.
Since these coherent modulators, like most microelectronic modules, need to be hermetically packaged, the optical internetworking forum (OIF) has introduced the specifications of high-bandwidth coherent driver modulator (HB-CDM) package.
Radio frequency (RF) performance for such packages plays a key role in module performance.
Multi layers high temperature co-fired ceramic (HTCC) provides high capabilities in terms of electrical routing density for tracks and vertical vias. According to the package surface-mount technology (SMT), we present the performance of two RF transition designs, first one called vertical transition up to 50 GHz (RF vertical vias through 13-14 HTCC layers) for packages with lead-frame SMT, and second design called coplanar transition up to 80 GHz (planar RF transmission lines without RF vertical vias) for flex printed circuit bord (F-PCB) SMT.
Want to know more? Download the full paper now with this link
In this article from EU Research (EU Research AUT21/P52), learn how Egide, with the other members of the "Heatpack" European consortium, tackles the problem of power dissipation with new packaging solutions.
At the 24th European Microelectronics & Packaging Conference (EMPC 2023), Egide presented its abilities to design and produce complex multi layers HTCC solutions for high frequency hermetic packages. These innovative solutions address the critical challenges faced by the electronics industry in developing high-performance devices for applications such as 5G, radar, and optical communications.
Coherent optical networks can provide larger transmission capacity and much distance up to 100 times mor than non-coherent networks (thousands Km for coherent versus tens Km for non-coherent). Coherent modulators are vital components for such high-speed coherent communication networks.
Since these coherent modulators, like most microelectronic modules, need to be hermetically packaged, the optical internetworking forum (OIF) has introduced the specifications of high-bandwidth coherent driver modulator (HB-CDM) package.
Radio frequency (RF) performance for such packages plays a key role in module performance.
Multi layers high temperature co-fired ceramic (HTCC) provides high capabilities in terms of electrical routing density for tracks and vertical vias. According to the package surface-mount technology (SMT), we present the performance of two RF transition designs, first one called vertical transition up to 50 GHz (RF vertical vias through 13-14 HTCC layers) for packages with lead-frame SMT, and second design called coplanar transition up to 80 GHz (planar RF transmission lines without RF vertical vias) for flex printed circuit bord (F-PCB) SMT.
Want to know more? Download the full paper now with this link
The Egide Group is a leading developer and manufacturer of hermetic package solutions for sensitive
micro-electronic and optical product applications, having manufacturing facilities in the USA and Europe,
and global customer support locations.
Our custom products are designed to meet the needs of a broad range of leading-edge product applications,
with strong technology barriers to entry, are found in the aerospace, defense, medical, opto-electronics,
infra-red, sensors, RF, communications, and other markets around the globe.
Our technologies are industry recognized with capabilities including Glass-To-Metal-Seal and
Ceramic-to-Metal-Seal technologies, High Temp Cofired Ceramic (HTCC) and thermal management solutions
specializing in an array of materials that provide excellent thermal conductivity with matched CTE values.
