Simulation and measurement results up to 100GHzAt the 24th European Microelectronics & Packaging Conference (EMPC 2023), Egide presented its abilities to design and produce complex multi layers HTCC solutions for high frequency hermetic packages. These innovative solutions address the critical [...]

Egide Group provides HTCC package development and manufacturing services in our European and USA manufacturing operations. Egide's High Temperature Co-Fired Ceramic (HTCC) manufacturing operation in the USA is now supported by the newly operational state-of-the-art plating [...]

In this article from EU Research (EU Research AUT21/P52), learn how Egide, with the other members of the "Heatpack" European consortium, tackles the problem of power dissipation with new packaging solutions.https://issuu.com/euresearcher/docs/heatpack_eur28_h_res https://heatpack.eu/

• New continuous and remote process monitoring systems • New environmentally friendly wastewater treatment   equipment • Enhanced efficiency and reliability    Egide Group (Euronext ParisTM - Segment C - ISIN code : FR0000072373) is pleased to announce the completion of the [...]

Reducing the size (and weight) and increasing the power capabilities of the ICs onboard are constant care-abouts for engineers when designing a satellite. Packages need to support increased strength of the signal (higher frequency of the signal) and to dissipate a lot of heat as the power [...]