Dans cet article de EU Research (EU Research AUT21/P52), découvrez comment Egide, aux côtés des autres membres du consortium européen "Heatpack", s'attaque au problème de la dissipation thermique avec de nouvelles solutions de boîtier.s
At the 24th European Microelectronics & Packaging Conference (EMPC 2023), Egide presented its abilities to design and produce complex multi layers HTCC solutions for high frequency hermetic packages. These innovative solutions address the critical challenges faced by the electronics industry in developing high-performance devices for applications such as 5G, radar, and optical communications.
Coherent
optical networks can provide larger transmission capacity and much distance up
to 100 times mor than non-coherent networks (thousands Km for coherent versus
tens Km for non-coherent). Coherent modulators are vital components for such
high-speed coherent communication networks.
Since these
coherent modulators, like most microelectronic modules, need to be hermetically
packaged, the optical internetworking forum (OIF) has introduced the
specifications of high-bandwidth coherent driver modulator (HB-CDM) package.
Radio
frequency (RF) performance for such packages plays a key role in module
performance.
Multi layers
high temperature co-fired ceramic (HTCC) provides high capabilities in terms of
electrical routing density for tracks and vertical vias. According to the
package surface-mount technology (SMT), we present the performance of two RF
transition designs, first one called vertical transition up to 50 GHz (RF
vertical vias through 13-14 HTCC layers) for packages with lead-frame SMT, and
second design called coplanar transition up to 80 GHz (planar RF transmission
lines without RF vertical vias) for flex printed circuit bord (F-PCB) SMT.
Want to know more? Download the full paper now with this link
Dans cet article de EU Research (EU Research AUT21/P52), découvrez comment Egide, aux côtés des autres membres du consortium européen "Heatpack", s'attaque au problème de la dissipation thermique avec de nouvelles solutions de boîtier.s
At the 24th European Microelectronics & Packaging Conference (EMPC 2023), Egide presented its abilities to design and produce complex multi layers HTCC solutions for high frequency hermetic packages. These innovative solutions address the critical challenges faced by the electronics industry in developing high-performance devices for applications such as 5G, radar, and optical communications.
Coherent
optical networks can provide larger transmission capacity and much distance up
to 100 times mor than non-coherent networks (thousands Km for coherent versus
tens Km for non-coherent). Coherent modulators are vital components for such
high-speed coherent communication networks.
Since these
coherent modulators, like most microelectronic modules, need to be hermetically
packaged, the optical internetworking forum (OIF) has introduced the
specifications of high-bandwidth coherent driver modulator (HB-CDM) package.
Radio
frequency (RF) performance for such packages plays a key role in module
performance.
Multi layers
high temperature co-fired ceramic (HTCC) provides high capabilities in terms of
electrical routing density for tracks and vertical vias. According to the
package surface-mount technology (SMT), we present the performance of two RF
transition designs, first one called vertical transition up to 50 GHz (RF
vertical vias through 13-14 HTCC layers) for packages with lead-frame SMT, and
second design called coplanar transition up to 80 GHz (planar RF transmission
lines without RF vertical vias) for flex printed circuit bord (F-PCB) SMT.
Want to know more? Download the full paper now with this link
Le Groupe Egide est l'un des principaux concepteurs et fabricants de boîtiers hermétiques pour composants microélectroniques et optiques sensibles. Il dispose de sites de production aux Etats-Unis et en Europe, ainsi que des équipes de vente dans le monde entier.
Nos produits sont conçus pour répondre aux besoins d'un large éventail de marchés de pointe à fortes barrières technologiques dont, notamment, les marchés de l'aérospatiale, de la défense, de la médecine, de l'optoélectronique, de l'infrarouge, des capteurs, de la RF, des communications et d'autres marchés dans le monde entier.
Nos technologies sont reconnues dans l'industrie, notamment nos technologies de scellements verre-métal et céramique-métal, de cuisson à haute température de composants céramiques (HTCC pour High Temperature Cofired Ceramic), et nos solutions de dissipation thermique dans un éventail de matériaux offrant une excellente conductivité thermique avec des valeurs CTE adaptées.
